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AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Hot -12 %
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

  • Product Id: 2839

  • Item Code/Product Code: EMMC-2
  • Weight: 0.01kg
AMAOE AMAOE
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₹175.00
₹199.00
Ex Tax: ₹175.00
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Description :


0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.


Features :
1. Brand New.
2. BGA stencil for reballing pins,  BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh.

Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material


MODEL NUMBERS SUPPORTED ;

BGA221

BGA153

BGA169

BGA254

BGA162

BGA186


Package Content*


1x AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

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Tags: AMAOE , STENCIL , REBALLNG PLATE , STEEL PLATE , OPPO , VIVO , QUALCOMM , BGA

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