MECHANIC XG-Z40 HIGH SYNTHETIC SOLDER PASTE FLUX FOR BGA REBALLING - 10ML

Description

MECHANIC XG-Z40 10ML High Synthetic Solder Paste Flux BGA Soldering Flux Paste BGA Soldering Tin Cream for BGA Reballing.

Features: 

1. The BGA flux solder paste is a high viscosity no-clean flux.
2. It is the mixture of high-quality alloyed powder and resin paste flux.
3. It can avoid the pale yellow residue, so you are easy to clean the board.
4. It can be used for PCB, BGA, SMD, PGA reworking.
5. It can be used for soldering and reballing of computer and phone chips.
6. It is a necessary material for repairing the mobile phone mainboard.
7. Help to repair the circuit boards and protect the electronic components.
8. The solder paste flux can only be sent out by special post mail.

Specification: 

• Item name: Solder Paste Flux
• Brand: MECHANIC
• Type: XG-Z40
• Material: Tin+solder paste
• Color: As picture shown
• Alloy: Sn63/Pb37
• Microns: 25-45um
• Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm

Package includes: 

• 1pc x MECHANIC BGA Solder Flux