KAISI BGA-IC REMOVER LIQUID TOOL (20ML)

Feature:

• 20ml BGA IC glue epoxy remover.

• Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.

• Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

• It won't do harm to your circuit board and components.

• Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.

• Convenient to use

  How to Use:

  • 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.

  • 2. Place a plastic bag or film on the top and cover the PCB board.

  • 3. Wait for about 20 minutes.

  • 4. Redo step 1 to step 3.

  • 5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.

  • 6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.

  • 7. To remove the chip with a tweezers or cutter

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  Package included:

  • 1 x BGA Glue

  • 1 x User Manua