KAISI 183°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G

Kaisi 40g 183°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Features:

• Kaisi 40g 183°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair
• Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
• High Density/High Resistance Strong Activity/Strong Welding Force
• Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
• Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
• Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
• Good soldering and welding tool

Package includes:

• 1 x Solder Paste