Menu
Your Cart

AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM

AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
-7 %
AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM

  • Product Id: 2762

  • Item Code/Product Code: OV-5
  • Weight: 0.01kg
AMAOE AMAOE
Based on 0 reviews. - Write a review
₹185.00
₹199.00
Ex Tax: ₹185.00
Add to Cart
Buy Now Ask Question
Add to Wish List Compare this Product
Chat via WhatsApp

AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM


MODEL NUMBERS SUPPORTED ;

53735

PM7250

PM7150A

MT6359VPP

58255

QPM5677

77040

BGA221

SDR865

BGA153

MT6190W

78191-21

MT6635XP

WCN3998

PM7250B

MT6885Z RAM

MT6885Z CPU

SM7250

MT6360PP

OPPO-REN03/3Pro/4/4Pro

VIVO-X50/50Pro/Z6

IQ00-21X


Package Content*

1x AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM

Write a review

Please login or register to review
Tags: AMAOE , STENCIL , REBALLNG PLATE , STEEL PLATE , OPPO , VIVO , QUALCOMM , BGA

We also recommend

Quickview
2UUL UNIVERSAL MOBLIE PHONE MIDDLE LAYER FRAME BGA REBALLING MAGNETIC PLATFORM 2UUL UNIVERSAL MOBLIE PHONE MIDDLE LAYER FRAME BGA REBALLING MAGNETIC PLATFORM
-16 %
2UUL UNIVERSAL MOBLIE PHONE MIDDLE LAYER FRAME BGA REBALLING MAGNETIC PLATFORM
2UUL Universal Phone Board Mid Frame Reballing Magnetic Platform For Iphone Cpu Ic Chip Tin Planting Template Fixture2UUL Universal Silicone Phone Boa..
₹795.00 ₹950.00
Ex Tax:₹795.00
Add to Cart
Add to Wish List Compare this Product
Quickview
A10 CPU MODULE BGA REBALLING WHITE STENCILS A10 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
A10 CPU MODULE BGA REBALLING WHITE STENCILS
Manufacturer:QianLiCompatible With:iPhone 7What’s Included:1 x QianLi 3D BGA Stencil Template - A10 CPU Module - iPhone 7 - S350..
₹200.00
Ex Tax:₹200.00
Add to Cart
Add to Wish List Compare this Product
Quickview
A11 CPU MODULE BGA REBALLING WHITE STENCILS A11 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
A11 CPU MODULE BGA REBALLING WHITE STENCILS
Manufacturer:QianLiCompatible With:iPhone 8What’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 8 - S500If you are ever unsu..
₹200.00
Ex Tax:₹200.00
Add to Cart
Add to Wish List Compare this Product
Quickview
A8 CPU MODULE BGA REBALLING WHITE STENCILS A8 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
A8 CPU MODULE BGA REBALLING WHITE STENCILS
Manufacturer:QianLiCompatible With:iPhone 6What’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 6 - BMW750If you are ever un..
₹200.00
Ex Tax:₹200.00
Add to Cart
Add to Wish List Compare this Product
Quickview
A9 CPU MODULE BGA REBALLING WHITE STENCILS A9 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
A9 CPU MODULE BGA REBALLING WHITE STENCILS
Manufacturer:QianLi/ToolPlusCompatible With:iPhone 6SWhat’s Included:1 x QianLi BGA Stencil Template - A9 CPU Module - iPhone 6S - E300..
₹200.00
Ex Tax:₹200.00
Add to Cart
Add to Wish List Compare this Product

From the same brand

Quickview
AMAOE 0.12MM UNIVERSAL STENCILS PLATE AMAOE 0.12MM UNIVERSAL STENCILS PLATE
Hot -12 %
AMAOE 0.12MM UNIVERSAL STENCILS PLATE
0.12MM Universal Stencils PlatePackage Content*1x AMAOE 0.12MM Universal Stencils Plates ..
₹175.00 ₹199.00
Ex Tax:₹175.00
Add to Cart
Add to Wish List Compare this Product
Quickview
AMAOE 24 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD / BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 15 SERIES - 0.12MM AMAOE 24 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD / BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 15 SERIES - 0.12MM
-29 %
AMAOE 24 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD / BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 15 SERIES - 0.12MM
Amaoe 0.12mm 24-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X to 15. Package includes: 2 x Tin Scraping Blade 1..
₹3,899.00 ₹5,500.00
Ex Tax:₹3,899.00
Add to Cart
Add to Wish List Compare this Product
Quickview
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
-10 % Out Of Stock
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Description ; Amaoe EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 0.15mm. 0.15MM Amaoe BGA S..
₹199.00 ₹220.00
Ex Tax:₹199.00
Add to Cart
Add to Wish List Compare this Product
Quickview
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Hot -12 %
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Description : 0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.Features : 1. Brand N..
₹175.00 ₹199.00
Ex Tax:₹175.00
Add to Cart
Add to Wish List Compare this Product
Quickview
AMAOE BGA REBALLING STENCIL FOR IPHONE 14/14 PLUS/14 PRO/14 PRO MAX APPLE A15/A16 CPU - 0.12MM
-10 %
AMAOE BGA REBALLING STENCIL FOR IPHONE 14/14 PLUS/14 PRO/14 PRO MAX APPLE A15/A16 CPU - 0.12MM
Amaoe 0.12mm BGA Reballing Stencil for iPhone 14/14 Plus/14 Pro/14 Pro Max Apple A15/A16 CPUPackage includes: 1 x Stencil..
₹199.00 ₹220.00
Ex Tax:₹199.00
Add to Cart
Add to Wish List Compare this Product