SUNSHINE SS-101F IC REPAIR ADVANCED BLADE SET FOR SEPARATING DOT MATRIX / GLUE REMOVAL / CHIP REMOVAL

Sunshine SS-101F Chip Repair Advanced Blade Set for Separating Dot Matrix/Glue Removal/Chip Removal

Features:

• Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips
• It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs
• The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin
• Super toughness, better protection of mobile phone chips
• Low center of gravity Is more stable, double-headed non-slip handle, low center of gravity more stable
• With universal handle, high-quality material selection, and a strong guarantee of product quality
• Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering

Specification:

• Brand: Sunshine
• Product Name: Chip Repair Premium Blade Set
• Model: SS-101F
• Weight: About 47g
• Shank Size: 135*9*9mm
• Blade Size: #1:6*41*0.4mm/#2:39*8.5*0.4mm#3:5.9*40*0.4mm
• Package Size: 170*84*12mm

Package includes:

• 1 x Knife handle
• 3 x Blade