Mechanic M35 Nano Flux Paste 35ml

Mechanic M35 Nano Flux Paste for Mobile Logic Board and IC Soldering

The Mechanic M35 Nano Flux Paste is a high-activity soldering flux engineered for precision mobile repair, IC reballing, and motherboard soldering. Formulated with advanced nano-grade activators, it ensures strong wetting ability, quick solder flow, and minimal residue after heating. Ideal for BGA, SMD, and logic board rework, the M35 provides stable performance even under high temperatures. It helps prevent oxidation, reduces bridging, and ensures cleaner joints during micro-soldering. Trusted by professional repair engineers across India, this paste enhances reliability and precision in every soldering process.

Features

• Original Mechanic M35 Nano Flux Paste for precision soldering work
• High-activity flux ensures fast solder wetting and bonding
• Perfect for IC reballing, BGA rework, and logic board soldering
• Nano-activated formula leaves minimal non-corrosive residue
• Prevents oxidation and improves solder joint quality
• Excellent thermal stability for extended soldering sessions
• Safe, halogen-free composition with mild odor
• Used widely by mobile and electronics repair professionals across India

Specification Key

Benefits

• Simplifies soldering of micro-components and BGA pads
• Reduces oxidation, ensuring long-lasting solder joints
• Helps achieve cleaner finishes with minimal residue
• Increases success rate in IC reballing and rework projects
• Saves time for technicians by enhancing solder flow
• Ideal for professional service centers and micro-soldering labs

Usage Tips

• Apply a thin, even layer of flux to the target area before heating
• Avoid excessive application to prevent residue build-up
• Use a hot-air station or rework tool at 280–320 °C for best results
• Clean the board with isopropyl alcohol after soldering
• Keep container tightly sealed after use to maintain quality

Package Content

• 1 × Mechanic M35 Nano Flux Paste (35 g)

FAQs

• Q1. What is Mechanic M35 Nano Flux Paste used for?
• It’s used for soldering, reballing, and repairing ICs and logic boards in mobile devices.
• Q2. Does it leave any residue after heating?
• Very little — it’s a low-residue, halogen-free formula for cleaner finishes.
• Q3. Can I use it for BGA rework?
• Yes, it’s ideal for BGA, SMD, and micro-soldering applications.
• Q4. Is this paste safe for professional repair use?
• Yes, it’s non-corrosive, halogen-free, and designed for repeated lab use.
• Q5. What is the working temperature range?
• It performs best between 180 °C and 350 °C depending on solder type.