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NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM

NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM
New -20 %
NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM

  • Product Id: 3556

  • Item Code/Product Code: SAM-16
  • Weight: 0.01kg
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₹250.00
Ex Tax: ₹199.00
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Nexst Sam-16 Black Cpu Bga Rework Reballing Stencil 0.12MM


Features :
1. Brand New.
2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh

Advantage:
1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material


Model Numbers Supported ;

  1. 58083-11
  2. 77098B
  3. SPU13P
  4. SHANNON 5511
  5. SPU14P
  6. QFM3576
  7. SM5714
  8. SAMSUNG E8825
  9. BGA 254
  10. SAMSUNG E8825 -2
  11. W2205
  12. S2131Y
  13. B267-11
  14. QPA5580
  15. SAMSUNG A53
  16. SAMSUNG A536
  17. EXYNOS 1280


Package Content*

1 X Nexst SAM-16 Stencil.

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Tags: NEXST , BALL PLATE , REBALLING STENCILS , SAMSUNG A53 , SAMSUNG STENCILS , BLACK STENCILS , BGA STENCILS , STENCIL PLATE ,

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