RELIFE RL-039 PASTED BGA IC EPOXY BLACK GLUE REMOVER LIQUID

550.00

Category:

Description

Relife RL-039 Remove Glue Liquid Softener Remove Plastic Adhesive PCB BGA Chip Solid Glue Degradation Motherboard Repair Tools

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin such as:
Phenolic Resin
Epoxy Resin
Acrylic Resin,
Polyurethane,
Silicone Resin
etc

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