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STENCILS/BALL PLATE

STENCILS/BALL PLATE

NEXST MQ 6 BLACK QUALCOMM/MTK POWER IC REWORK REBALLING STENCILS - 0.12MM
-10 % Out Of Stock
Brand: NEXST Item Code/Product Code: MQ-6
Nexst Mq 6 Black Qualcomm/Mtk Power Ic Rework Reballing Stencils - 0.12MMFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. ..
₹199.00 ₹220.00
Ex Tax:₹199.00
NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM
-20 %
Brand: NEXST Item Code/Product Code: SAM-16
Nexst Sam-16 Black Cpu Bga Rework Reballing Stencil 0.12MMFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. Precise Pins Lo..
₹199.00 ₹250.00
Ex Tax:₹199.00
NEXST U-SMU2 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS - 0.12MM
-8 % Out Of Stock
Brand: NEXST Item Code/Product Code: U-SMU2
Nexst U-Smu2 Cpu Bga Reballing Stencil For Samsung ExynosFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. Precise Pins Loc..
₹165.00 ₹180.00
Ex Tax:₹165.00
NEXST UNIVERSAL BLACK STENCIL 0.3/0.35/0.4/0.5 MULTIFUNCTIONAL REBALLING STENCILS - 0.12MM
-20 %
Brand: NEXST Item Code/Product Code: UNIVERSAL
Description: NEXST Black Steel BGA Reballing Stencil Kit 0.3/0.35/0.4/0.5mm multifunction universal steel mesh for tin planting.   Features: 1. High Quality Stainless Steel Reballing Stencil 2. Colour: Black (Square Hole ). 3. Make your repair work easier. Package contains: 1 x Nexst ..
₹199.00 ₹250.00
Ex Tax:₹199.00
QIANLI 6S/6P BGA REBALLING STENCILS
-20 %
Brand: QIANLI / TOOLPLUS Item Code/Product Code: A8 CPU
Manufacturer:QianLiCompatible With:iPhone 6S/6PWhat’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 6S/6P - QS01If you are ever unsure of how to install your part or would like any assistance, please feel free to contact us.Please make sure you have chosen the right pa..
₹199.00 ₹250.00
Ex Tax:₹199.00
Brand: QIANLI / TOOLPLUS Item Code/Product Code: HW-4
BGA stencils HI6220 / 6250 / MSM8952 CPU (HW:4) 0.12mmPioneering half etching processCooling hole patented designUltra-precise round square hole positioning0.12MM STENCILS PLATES FOR HUAWEI- P8 / P9,HONOR 4X / 4C/ 5A / 5C / HI6220 / MAM8952 CPU (HW-4)..
₹400.00
Ex Tax:₹400.00
QIANLI MEGA IDEA (BZ 26) 0.12MM BLACK STENCIL UNIVERSAL 0.3/0.35/0.4/0.5 MULTIFUNCTIONAL REBALLING STENCILS
Hot -18 %
Brand: QIANLI/MEGA IDEA Item Code/Product Code: BZ-26
Qianli 0.12MM Black Stencil Universal 0.3/0.35/0.4/0.5 Multifunctional Reballing Stencils ( BZ  26 )Packing Content*1x  Qianli 0.12MM Black Stencil Universal 0.3/0.35/0.4/0.5 Multifunctional Reballing Stencils ( BZ  26 )..
₹230.00 ₹280.00
Ex Tax:₹230.00
WELSOLO VS04 UNIVERSAL IC REBALLING STENCIL WELSOLO VS04 UNIVERSAL IC REBALLING STENCIL
-18 %
Brand: MECHANIC Item Code/Product Code: VS04
Advantage: 1. Deformation resistant material2. Precise pins location3. Square round hole4. Good materialProduct Specification:Brand Name: WELSOLOModel Number: UNIVERSAL STENCILSMaterial: SteelUsage: ReballingColour: WHITEType: For BGA/CPUOperating Temperature: -50~500CModel :  ( VS04 ..
₹99.00 ₹120.00
Ex Tax:₹99.00
Item Code/Product Code: IP 12
WL Gold BGA CPU IC Reballing Stencil Tin Net for iPhone 12 /12 PRO/ 12 PRO MAX   Package includes: 1 x Gold Stencil net..
₹350.00
Ex Tax:₹350.00
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
2-3 Days
Brand: WYLIE Item Code/Product Code: EMMC/EMCP
Description ;WYLIE EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 3D. 3D WYLIE BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.Features : 1. Brand New. 2. BGA stencil for reballing pins for MP..
₹550.00
Ex Tax:₹550.00
WYLIE WL-50 BGA BLACK REBALLING STENCIL BLUETOOTH/WIFI IC - 0.12MM WYLIE WL-50 BGA BLACK REBALLING STENCIL BLUETOOTH/WIFI IC - 0.12MM
Out Of Stock
Brand: WYLIE Item Code/Product Code: WL 50
Description :For Oppo Series Integrated Reballing Template Live For Mi For Huawei For Vivo New Version Of The Cpu Source, Power Supply, Etc.Features :1. Brand New.2. Wylie Bga Font Power Ic Reballing Template Wl-50 - BLACK Ic Reballing Pins Solder Tin Plant Net,Wylie Square Hole Heating Steel M..
₹350.00
Ex Tax:₹350.00
Brand: WYLIE Item Code/Product Code: WL 52
Description :For Oppo Series Integrated Reballing Template Live For Mi For Huawei For Vivo New Version Of The Cpu Source, Power Supply, Etc.Features :1. Brand New.2. Wylie Cpu Font Power Ic Reballing Template Wl-52 - Silver Ic Reballing Pins Solder Tin Plant Net,Wylie Square Hole Heating Steel MeshA..
₹250.00
Ex Tax:₹250.00
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