New
FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G
Product Id: 3697
- Item Code/Product Code: FKG183
- Weight: 0.05kg
₹299.00
Ex Tax: ₹299.00
FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G
Features:
- 100% brand new and high quality
- Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
- Good soldering and welding tool
- Microns: 20-38um
- Use for Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc
- Lead solder paste, 183℃ degree of melting point, easy welding, easy moulding
Package includes:
1 x Fonekong Solder Paste.
