MAANT 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G

FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G

MODEL - FKG183

299

Features:

• 100% brand new and high quality
• Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
• Good soldering and welding tool
• Microns: 20-38um
• Use for Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc
• Lead solder paste, 183℃ degree of melting point, easy welding, easy moulding

Package includes:

1 x Fonekong Solder Paste.