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STENCILS/BALL PLATE

STENCILS/BALL PLATE

MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
Out Of Stock
Brand: MECHANIC Item Code/Product Code: IBGA 12 PRO
DescriptionMechanic iBGA 12 Pro 10 in 1 motherboard middle rework tin mesh platform for iPhone X-12 Pro Max repair. Mechanic motherboard middle frame positioning tin planting platform for iPhone X-12 Pro Max motherboard middle layer soldering repair.Features:1. Mechanic iBGA 12 Pro 10 in 1 set: for ..
₹1,650.00
Ex Tax:₹1,650.00
MECHANIC IBGA 13 MAX 14-IN-1 MOTHERBOARD MIDDLE LAYER REBALLING PLATFORM FOR IPHONE X TO 13 PRO MAX MECHANIC IBGA 13 MAX 14-IN-1 MOTHERBOARD MIDDLE LAYER REBALLING PLATFORM FOR IPHONE X TO 13 PRO MAX
-17 %
Brand: MECHANIC Item Code/Product Code: IBGA 13 MAX
DescriptionMECHANIC IBGA13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X - 13 Pro Max Mini,Mechanic Middle Layer Tin Planting Platform iBGA13 MAX for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Tin plan..
₹2,199.00 ₹2,650.00
Ex Tax:₹2,199.00
MECHANIC MI-410 QUALCOMM POWER IC REWORK REBALLING STENCIL FOR REDMI NOTE 4/4X/PRO
Out Of Stock
Brand: MECHANIC Item Code/Product Code: MI-410
MECHANIC MI-410 QUALCOMM POWER IC REWORK REBALLING STENCIL FOR REDMI NOTE 4/4X/PROMODEL NUMBERS SUPPORTED ;REDMI NOTE 4/4X/PROPackage Content*1x MECHANIC MI-410 QUALCOMM POWER IC REWORK REBALLING STENCIL FOR REDMI NOTE 4/4X/PRO..
₹199.00
Ex Tax:₹199.00
Brand: MECHANIC Item Code/Product Code: UFO-8
Description :MECHANIC UFO BGA Reballing Stencil Tin Planting Positioning Template Maintenance Steel Mesh Net For iPhone  12/12 Pro/12 Pro Max/12Mini Motherboard IC Chip.Specification:Support model: iPhone 12/12 Mini/12 Pro/12 Pro MaxName: Rounded Rectangle Hole Steel StencilModel: Flying saucer..
₹199.00
Ex Tax:₹199.00
Brand: MECHANIC Item Code/Product Code: UFO-9
Description :MECHANIC UFO BGA Reballing Stencil Tin Planting Positioning Template Maintenance Steel Mesh Net For 13/13 Pro/13 Pro Max/13Mini Max Motherboard IC Chip.Specification:Support model: iPhone 13/13 Pro/13 Pro Max/13Mini MaxName: Rounded Rectangle Hole Steel StencilModel: Flying saucer serie..
₹199.00
Ex Tax:₹199.00
MECHANIC X20 STENCILS SCRAPPER FOR REBALLING SOLDER PASTE - 0.20MM MECHANIC X20 STENCILS SCRAPPER FOR REBALLING SOLDER PASTE - 0.20MM
-50 %
Brand: MECHANIC Item Code/Product Code: X20
Product Details :Metal Spudger Great For Fitting Into Tight PlacesRotate From Left To Right To Gently Lift Housings ApartPulling The Spudger Up While Attempting To Separate Housings May Bend The Tool, Use Rotation InsteadLight Weight And Thin DesignEasy To Use And Handle   Package Contains..
₹50.00 ₹100.00
Ex Tax:₹50.00
Brand: MECHANIC Item Code/Product Code: X22
Product Details :Metal Spudger Great For Fitting Into Tight PlacesRotate From Left To Right To Gently Lift Housings ApartPulling The Spudger Up While Attempting To Separate Housings May Bend The Tool, Use Rotation InsteadLight Weight And Thin DesignEasy To Use And Handle   Package Contains..
₹60.00
Ex Tax:₹60.00
Brand: QIANLI/MEGA IDEA Item Code/Product Code: 6G/6+
✅ Perfect for reballing IC chips on iPhone 6 and iPhone 6 Plus✅ DURABLE - Made of metal allowing a lot of uses✅ DESIGN - Designed to help with repairs✅ High quality material✅ Easy to use..
₹200.00
Ex Tax:₹200.00
MIJING DOT MATRIX TIN PLATING STENCIL STEEL MESH FOR IPHONE X-11PRO MAX Face ID
-43 %
Item Code/Product Code: IPH-14
MiJing universal Dot Matrix tin planting steel mesh for iPhone X XR XS XS MAX 11 11 Pro 11 Pro Max Face ID 0.12mm reballing stencil, MJ tin planting steel mesh for iPhone Face ID / Dot Matrix / Original Color / Tail Plug small plate / Tail Plug IC tinned steel, precise hole position enough tin ..
₹199.00 ₹350.00
Ex Tax:₹199.00
Brand: MIJING Item Code/Product Code: IP-X
Description:1.Mijing interposer middle plate for iPhone X.2.iPhone X double-stacked board separation frame. 3.MJ iPhone motherboard middle layer reballing frame for motherboard upper lower layer separating soldering. Compatible Models: For iPhone XPackage Contains:1 x Middle Layer Plate..
₹299.00
Ex Tax:₹299.00
MTK MT-1 SERIES POWER IC BGA REWORK REBALLING STENCILS MTK MT-1 SERIES POWER IC BGA REWORK REBALLING STENCILS
-12 %
Brand: AMAOE Item Code/Product Code: MT-1
AMAOE 19 in 1 MTK MT Series Power IC BGA Reballing Stencil Template, 0.12MM MTK phones power IC Repair BGA Rework Reballing Stencil Template kit, with imported steel material and heat dissipating holes for professional soldering rework repairs. MT6311P MT6339A MT6155A MT66280P power IC BGA Reballing..
₹175.00 ₹199.00
Ex Tax:₹175.00
Brand: NEXST Item Code/Product Code: CHG-1
Nexst CHG1 0.12mm Charging IC Comprehensive BGA Reballing Stencil Package includes: 1 x Stencil..
₹165.00 ₹180.00
Ex Tax:₹165.00
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