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AMAOE

Brand: AMAOE Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a high-precision, laser-cut stainless steel stencil designed specifically for iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an ultra..
₹140.00
Ex Tax:₹140.00
AMAOE 1+10P MIDDLE FRAME | 1+10p Stencil Middle Layer BGA REBALLING STENCIL FOR ONE PLUS 10 PRO - 0.12MM
-30 % Out Of Stock
Brand: AMAOE Item Code/Product Code: 1+10P
Amaoe 1+10P middle frame for mobile repair. Ideal for precision assembly, reballing, and PCB repairs. Includes middle layer support for enhanced stability.Precision Stencil for One Plus 10 Pro Circuitry Repairs:Model-Specific Design: Tailored specifically for the One Plus 10 Pro, ensuring ..
₹140.00 ₹200.00
Ex Tax:₹140.00
AMAOE 1+11 MIDDLE FRAME BGA REBALLING STENCIL FOR ONE PLUS 11 - 0.12MM
-30 % Out Of Stock
Brand: AMAOE Item Code/Product Code: 1+11
Precision Stencil for One Plus 11 Circuitry Repairs: Model-Specific Design: Tailored specifically for the One Plus 11, ensuring a perfect fit for precise repair work. High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement. Ultra-Th..
₹140.00 ₹200.00
Ex Tax:₹140.00
AMAOE 1+9P MIDDLE FRAME BGA REBALLING STENCIL FOR ONE PLUS 9 PRO - 0.12MM
-30 % Out Of Stock
Brand: AMAOE Item Code/Product Code: 1+9P
AMAOE 1+9P MIDDLE FRAME BGA REBALLING STENCIL Amaoe 1+ 9P Middle Frame BGA Reballing Stencil is an essential for OnePlus 9 Pro repairs. It's a high-precision BGA reballing plate and middle layer reballing stencil designed for accurate micro-soldering, making it a key tool for mobile phone repai..
₹140.00 ₹200.00
Ex Tax:₹140.00
AMAOE 28 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 16 SERIES - 0.12MM AMAOE 28 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 16 SERIES - 0.12MM
-29 %
Brand: AMAOE Item Code/Product Code: 28IN1
Amaoe 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X-16PMPackage includes:2 x Tin Scraping Blade5 x Positioning Plate1 x Magnetic Base1 x Tin Insulation18 x Stencil..
₹3,899.00 ₹5,500.00
Ex Tax:₹3,899.00
AMAOE BB-2 BASEBAND / HARD DISK / WIFI / NFC / CODE CHIP BGA REBALLING STENCIL FOR IPHONE 7G-15PM - 0.12MM
-30 %
Brand: AMAOE Item Code/Product Code: BB-2
AMAOE BB-2 BASEBAND / HARD DISK / WIFI / NFC / CODE CHIP BGA REBALLING STENCIL FOR IPHONE 7G-15PM - 0.12MM Features : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1..
₹140.00 ₹200.00
Ex Tax:₹140.00
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil for A15 Bionic CPU - 0.12MM
New Out Of Stock
Brand: AMAOE Item Code/Product Code: MIDDLE LAYER
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair techni..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹140.00
Ex Tax:₹140.00
AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
-28 % Out Of Stock
Brand: AMAOE Item Code/Product Code: EMMC 1
Description ; Amaoe EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 0.15mm. 0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2. Features : 1. Brand New. 2. BGA stencil for reballi..
₹145.00 ₹200.00
Ex Tax:₹145.00
AMAOE BGA REBALLING STENCIL FOR IPHONE 14/14 PLUS/14 PRO/14 PRO MAX APPLE A15/A16 CPU - 0.12MM
-28 %
Brand: AMAOE Item Code/Product Code: IP-14
Amaoe 0.12mm BGA Reballing Stencil for iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max Apple A15 / A16 CPU Amaoe BGA reballing stencil for iPhone 14/14 Plus/Pro/Pro Max. Compatible with Apple A15 & A16 CPUs. High heat resistance & perfect alignment. Ideal for professional IC repair and soldering ..
₹145.00 ₹200.00
Ex Tax:₹145.00
Brand: AMAOE Item Code/Product Code: BS-01
Amaoe BS 1 BGA Reballing Stencil for Black Shark 3 / 3Pro / 3S / 4 / 4Pro / 4S, Snapdragon 865 / 870 / 888 / SM8250 / 8350 Tin Planting Net..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE Item Code/Product Code: BS 2
Amaoe BS-2 Stencil 0.12mm BGA Reballing Stencil for IC Chip & PCB RepairFeatures:..
₹140.00
Ex Tax:₹140.00
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