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STENCILS/BALL PLATE

STENCILS/BALL PLATE

2UUL BH11 UNIVERSAL MOBLIE PHONE MIDDLE LAYER FRAME BGA REBALLING MAGNETIC PLATFORM 2UUL BH11 UNIVERSAL MOBLIE PHONE MIDDLE LAYER FRAME BGA REBALLING MAGNETIC PLATFORM
-28 % Out Of Stock
Brand: 2UUL Item Code/Product Code: BH11
2UUL Universal Phone Board Mid Frame Reballing Magnetic Platform For Iphone Cpu Ic Chip Tin Planting Template Fixture2UUL Universal Silicone Phone Board Mid Frame Reballing Magnetic Platform,Special Design For Phone Board Mid Frame Reballing, 2UUL Universal Silicone Magnetic Platform Motherboard Mid..
₹680.00 ₹950.00
Ex Tax:₹680.00
A10 CPU MODULE BGA REBALLING WHITE STENCILS A10 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
Brand: QIANLI / TOOLPLUS Item Code/Product Code: A10 CPU
Manufacturer:QianLiCompatible With:iPhone 7What’s Included:1 x QianLi 3D BGA Stencil Template - A10 CPU Module - iPhone 7 - S350..
₹200.00
Ex Tax:₹200.00
A11 CPU MODULE BGA REBALLING WHITE STENCILS A11 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
Brand: QIANLI / TOOLPLUS Item Code/Product Code: A11 CPU
Manufacturer:QianLiCompatible With:iPhone 8What’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 8 - S500If you are ever unsure of how to install your part or would like any assistance, please feel free to contact us.Please make sure you have chosen the right part befor..
₹200.00
Ex Tax:₹200.00
A8 CPU MODULE BGA REBALLING WHITE STENCILS A8 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
Brand: QIANLI / TOOLPLUS Item Code/Product Code: A8 CPU
Manufacturer:QianLiCompatible With:iPhone 6What’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 6 - BMW750If you are ever unsure of how to install your part or would like any assistance, please feel free to contact us.Please make sure you have chosen the right part bef..
₹200.00
Ex Tax:₹200.00
A9 CPU MODULE BGA REBALLING WHITE STENCILS A9 CPU MODULE BGA REBALLING WHITE STENCILS
Out Of Stock
Brand: QIANLI / TOOLPLUS Item Code/Product Code: A9 CPU
Manufacturer:QianLi/ToolPlusCompatible With:iPhone 6SWhat’s Included:1 x QianLi BGA Stencil Template - A9 CPU Module - iPhone 6S - E300..
₹200.00
Ex Tax:₹200.00
AMAOE 1+10P MIDDLE FRAME | 1+10p Stencil Middle Layer BGA REBALLING STENCIL FOR ONE PLUS 10 PRO - 0.12MM
-18 %
Brand: AMAOE Item Code/Product Code: 1+10P
Amaoe 1+10P middle frame for mobile repair. Ideal for precision assembly, reballing, and PCB repairs. Includes middle layer support for enhanced stability.Precision Stencil for One Plus 10 Pro Circuitry Repairs:Model-Specific Design: Tailored specifically for the One Plus 10 Pro, ensuring ..
₹165.00 ₹200.00
Ex Tax:₹165.00
AMAOE 1+11 MIDDLE FRAME BGA REBALLING STENCIL FOR ONE PLUS 11 - 0.12MM
-18 %
Brand: AMAOE Item Code/Product Code: 1+11
Precision Stencil for One Plus 11 Circuitry Repairs: Model-Specific Design: Tailored specifically for the One Plus 11, ensuring a perfect fit for precise repair work. High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement. Ultra-Th..
₹165.00 ₹200.00
Ex Tax:₹165.00
AMAOE 1+9P MIDDLE FRAME BGA REBALLING STENCIL FOR ONE PLUS 9 PRO - 0.12MM
-18 %
Brand: AMAOE Item Code/Product Code: 1+9P
Amaoe 1+ 9P Middle Frame BGA Reballing Stencil is an essential for OnePlus 9 Pro repairs. It's a high-precision BGA reballing plate and middle layer reballing stencil designed for accurate micro-soldering, making it a key tool for mobile phone repair.Precision Stencil for One Plus 9 Pro Circuitry Re..
₹165.00 ₹200.00
Ex Tax:₹165.00
AMAOE 28 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 16 SERIES - 0.12MM AMAOE 28 IN 1 IPHONE MIDDLE LAYER MOTHERBOARD BGA REBALLING STENCIL PLATFORM SET FOR IPHONE X TO 16 SERIES - 0.12MM
-29 %
Brand: AMAOE Item Code/Product Code: 28IN1
Amaoe 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X-16PMPackage includes:2 x Tin Scraping Blade5 x Positioning Plate1 x Magnetic Base1 x Tin Insulation18 x Stencil..
₹3,899.00 ₹5,500.00
Ex Tax:₹3,899.00
AMAOE BB-2 BASEBAND / HARD DISK / WIFI / NFC / CODE CHIP BGA REBALLING STENCIL FOR IPHONE 7G-15PM - 0.12MM
-28 %
Brand: AMAOE Item Code/Product Code: BB-2
AMAOE BB-2 BASEBAND / HARD DISK / WIFI / NFC / CODE CHIP BGA REBALLING STENCIL FOR IPHONE 7G-15PM - 0.12MM Features : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1..
₹145.00 ₹200.00
Ex Tax:₹145.00
Brand: AMAOE Item Code/Product Code: MIDDLE LAYER
High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair technicians seeking reliable reballing solutions.AMAOE BGA iPhone 13 P..
₹350.00
Ex Tax:₹350.00
Brand: AMAOE Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹350.00
Ex Tax:₹350.00
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