MECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools

MECHANIC solder ball 10000PCS/Bottle 

Composition : Sn63/Pb37 ( 63% tin /  37% lead )

The BGA solder ball has the following characteristics:

• Meet EU ROHS and REACH standards.
• With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
• Purity and sphericity are very high, no surface defects.
• Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
• The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
• When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.

Package Content*
1x Mechanic XZ10 Solder Ball - 10000 Pieces (0.50mm)

High-precision Process Manufacturing

Strictly control the tolerance (the internal control tolerance is about 8μm), the size is uniform, and the antioxidant capacity is improved.

0.20mm - 0.76mm

A variety of specifications are available.

Small tolerance, no static electricity, melting point 217℃.

Widely Application

For computer motherboard repair and various BGA planting tin.

CONCISE & DELICATE

Uncompromising performance in an ultra light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.