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FLUX / SOLDER PASTE

FLUX / SOLDER PASTE

Item Code/Product Code: FM-01
Description :Welding Oil Flux Booster Aluminum Alloy Soldering Needle Barrel Push Rod Propulsion Repair Maintenance Tools Specification: Material:Aluminium AlloyColor: Silver Grey Product Size: 85 X 20 X 20mm/3.35 X 0.79 X 0.79" Compatible: Suitable for Needle Barrel Welding OilNote: 1. Due to the d..
₹99.00
Ex Tax:₹99.00
Item Code/Product Code: MY-83A
FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42GMODEL - FKG183299Features: 100% brand new and high quality Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on Good soldering and welding tool Microns: 20-38um Use for..
₹345.00
Ex Tax:₹345.00
GLASS SYRINGE LUER WITH NEEDLE FOR FLUX/SOLDER PASTE - 10ML GLASS SYRINGE LUER WITH NEEDLE FOR FLUX/SOLDER PASTE - 10ML
-34 %
Item Code/Product Code: SYRINGE 10 ML
Descriptions : Jiaxix 10ml Glass Syringes With Caps High Quality - Made of high quality glass, more corrosion and acids resistant than plastic syringes. Clear Scales - With clear scale, which is easy to read and precisely to deliver liquid . Widely Usage - It can be widely used for liquids, oils,..
₹99.00 ₹150.00
Ex Tax:₹99.00
Item Code/Product Code: CP 2015
Goot Wick CP-2015 Desoldering Remover Original Feature: Quickly removes unwanted solder when used with a soldering iron. Only touch the grip and the pack of desoldering wick when desoldering. Failure to do so will result in serious burns. To avoid fire, never use a soldering iron and desolde..
₹105.00
Ex Tax:₹105.00
GS-2015 DESOLDER WIRE GS-2015 DESOLDER WIRE
Out Of Stock
Brand: GSM SOURCES Item Code/Product Code: GS-2015
Description: mobile phone Motherboard Repair BGA Desoldering wire, absorption wire Soldering Accessory assistant for removes unwanted solder Quickly, Sucking line BGA Desoldering Solder Wire BGA Tin Absorbtion line, Desoldering Wire Solder wick Except for the tin absorbing excess solder. 9..
₹99.00
Ex Tax:₹99.00
HM 501 HEAT-DISSIPATING THERMAL CONDUCTIVE GREASE FOR MOTHERBOARD CPU REPAIR HM 501 HEAT-DISSIPATING THERMAL CONDUCTIVE GREASE FOR MOTHERBOARD CPU REPAIR
-72 % Out Of Stock
Item Code/Product Code: HM501
HM 501 Thermal Conductive Grease Paste Adhesive for CPU GPU Reduce High Temperature Heat-dissipating Silicone PasteReasons To Buy : Multi purpose: it can be used to seal cpu, gpu, power cable, computer host, laptop, notebook computer, dvd, vcd, lid, set-top box and any other peripherals.  Top..
₹99.00 ₹350.00
Ex Tax:₹99.00
Item Code/Product Code: CP-1
The JTX CP1 Nano Solder Paste Flux is a high-performance soldering solution formulated for precision electronic repairs and assembly work. With a melting point of 183°C, it is ideal for tasks that demand accuracy and strong conductivity, such as jumper wire soldering, connector repairs, and tail plu..
₹199.00
Ex Tax:₹199.00
KAISI 138 DEGREE SOLDERING PASTE - 20G
-16 % Out Of Stock
Brand: KAISI Item Code/Product Code: 138 DEGREE
..
₹169.00 ₹200.00
Ex Tax:₹169.00
Brand: KAISI Item Code/Product Code: 138°C
Kaisi 138°C Low Temperature Smt Lead Free Solder Paste - 40GDescription :Brand Name: KAISIOrigin: CN(Origin)Certification: YESModel Number: 138 DEGREEParticle Size: 20-38μmName: Highly compatible SMT solder pasteMelting point: 138℃Specification: 40GStorage environment: 0-10℃ 12 monthsApplicable type..
₹250.00
Ex Tax:₹250.00
KAISI 183°C HIGH TEMPERATURE SMT LEAD FREE SOLDER PASTE - 20G KAISI 183°C HIGH TEMPERATURE SMT LEAD FREE SOLDER PASTE - 20G
Out Of Stock
Brand: KAISI Item Code/Product Code: 183°C
Kaisi 183°C High Temperature Smt Lead Free Solder Paste - 20G Description : Brand Name: KAISI Origin: CN(Origin) Certification: YES Model Number: 183 DEGREE Particle Size: 20-38μm Name: Highly compatible SMT solder paste Melting point: 183℃ Specification: 20G Storage environment: 0-10℃ 12 ..
₹165.00
Ex Tax:₹165.00
Brand: KAISI Item Code/Product Code: 183°C
Kaisi 40g 183°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA RepairFeatures: Kaisi 40g 183°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair Tin Lighting/Climbing Tin Strong/High Purity/Temperature Stand..
₹250.00 ₹275.00
Ex Tax:₹250.00
KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G
-22 % Out Of Stock
Brand: KAISI Item Code/Product Code: 220 DEGREE
Kaisi 40g 220°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA RepairFeatures: Kaisi 40g 220°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair Tin Lighting/Climbing Tin Strong/High Purity/Temperature Stand..
₹350.00 ₹450.00
Ex Tax:₹350.00
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