Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming

Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming

Features:

• Mechanic IX 5 Ultra universal breakthrough preheating platform, no air gun, no soldering iron, uniform heating
• Layering / Tinning / Laminating / Degumming, Compact & Lightweight
• Uniform heating, no air gun, no solder iron, aluminum alloy panel, freely controlled temperature
• Fit all sizes of cell phone motherboards, support motherboard delamination, lamination, dot matrix repair

Specification:

• Name: Universal Preheating Platform
• Gross Weight: 381.7g
• Model: Breakthrough iX 5Ultra
• Net Weight: 181.7g
• Voltage 110V /220V
• Product Size: 80*80*57.6mm
• Package Size 182*150*55mm
• Scope: Support motherboard delamination, lamination, and dot matrix repair
• Preheating Temperature Range: 20~260°C

Package includes:

• 1 x Preheating Platform
• 1 x Power Cable