-550x550.jpg "JTX GS-01 Green UV Solder Mask Stencil Kit for iPhone Qualcomm IC Repair")
-550x550.jpg "JTX GS-01 Green UV Solder Mask Stencil Kit for iPhone Qualcomm IC Repair")
-550x550.jpg "JTX GS-01 Green UV Solder Mask Stencil Kit for iPhone Qualcomm IC Repair")
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-80x80.jpg "JTX GS-01 Green UV Solder Mask Stencil Kit for iPhone Qualcomm IC Repair")
-80x80.jpg "JTX GS-01 Green UV Solder Mask Stencil Kit for iPhone Qualcomm IC Repair")
JTX GS-01 Green UV Solder Mask Stencil Kit for iPhone Qualcomm IC Repair
Id: 4109
- Item Code/Product Code: GS01
- Weight: 0.01kg
- SKU: 38842
₹625.00
Ex Tax: ₹625.00
JTX GS01 Green UV Solder Mask for Qualcomm Series IC Repair
JTX GS-01 is a 17-piece UV green solder mask stencil set designed for mobile motherboard repair. Ideal for iPhone, Qualcomm, and BGA IC protection. Helps prevent short circuits during soldering with clean, accurate masking.
Specifications & Features
- Form Factor: Paste-type green UV solder mask, 10ml
- Insulation Strength: High dielectric strength for IC pad isolation
- UV Curing Time: Cures under UV light in 10–20 seconds
- Application Use: Qualcomm IC repair, pad insulation, micro reballing
- Rework Friendly: Easily removable without damaging original PCB traces
- Stencil Compatibility: Designed for use with UV stencils on Qualcomm & multi-brand chips
- Material Type: Non-conductive, resin-based UV curable compound
- Residue: Leaves no sticky residue post-curing
- Precision Control: Fine tip dispenser ensures accurate and consistent masking
Installation & Usage Guide
- Clean Area: Use isopropyl alcohol to clean the target PCB or IC pad area.
- Apply Green Mask: Gently squeeze the tube and apply a small amount onto the target pad or component area.
- Cure With UV Light: Shine a UV lamp on the applied area for 10–20 seconds until fully cured.
- Inspect: Remove stencil and inspect the masked area for completeness.
Package Includes
- 17× Metal Solder Mask Stencils (iPhone & Qualcomm series)
What is JTX GS01 UV Solder Mask used for?
JTX GS01 is a green UV-curable solder mask designed for micro soldering tasks like Qualcomm IC rework, pad protection, and circuit board insulation. It cures rapidly under UV light, ensuring precise application and durability during mobile repair.
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