Koocu Universal Black Stencil for Qualcomm, MediaTek, Snapdragon Processors

Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.

Features:

1. Universal design compatible with multiple chip types
2. High-temperature resistant black material
3. Precision-machined holes for accurate ball positioning
4. Anti-static properties for component protection
5. Durable construction for repeated use

Model Numbers Supported

1. Qualcomm Snapdragon 845, 855, 865, 888, 8 Gen 1
2. MediaTek Dimensity 700, 800, 900, 1000, 1200, 8000, 9000
3. Samsung Exynos 850, 880, 990, 1080, 2100, 2200
4. Apple A12, A13, A14, A15, A16 Bionic
5. Hi-Silicon Kirin 960, 970, 980, 990, 9000
6. NVIDIA Tegra X1, X2
7. Intel Core i3, i5, i7, i9 mobile processors
8. AMD Ryzen 3, 5, 7 mobile processors

Package includes:

1. 1 x Stencil