New
QIANLI QS 67 BGA IC Rework Reballing Stencil for Mobile Repair
Id: 4050
- Item Code/Product Code: QS 67
- Weight: 0.05kg
₹145.00
Ex Tax: ₹145.00
The QIANLI QS-67 BGA IC Rework Reballing Stencil is designed for precise reballing of mobile BGA ICs, ensuring accurate soldering and easy repair tasks.
Features:
- Made of strong stainless steel
- 0.12mm thickness for accuracy
- Reusable and durable
- Easy to use for mobile repair
- Durable, reusable design for professional rework environments
- Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
- BGA107
- BGA95
- BGA182
- BGA202
- BGA130
- BGA199
- BGA137
- BGA63
- BGA127
- BGA134
Package includes:
- 1 x Stencil
