STENCILS/BALL PLATE
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 63
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing KitFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repa..
₹199.00
Ex Tax:₹199.00
Brand: MECHANIC
Item Code/Product Code: VS04
Advantage: 1. Deformation resistant material2. Precise pins location3. Square round hole4. Good materialProduct Specification:Brand Name: WELSOLOModel Number: UNIVERSAL STENCILSMaterial: SteelUsage: ReballingColour: WHITEType: For BGA/CPUOperating Temperature: -50~500CModel : ( VS04 ..
₹99.00 ₹120.00
Ex Tax:₹99.00
Item Code/Product Code: IP 12
WL Gold BGA CPU IC Reballing Stencil Tin Net for iPhone 12 /12 PRO/ 12 PRO MAX
Package includes:
1 x Gold Stencil net..
₹550.00
Ex Tax:₹550.00
Brand: WYLIE
Item Code/Product Code: EMMC/EMCP
Description ;WYLIE EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 3D.
3D WYLIE BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.Features :
1. Brand New.
2. BGA stencil for reballing pins for MP..
₹450.00
Ex Tax:₹450.00
Brand: WYLIE
Item Code/Product Code: WL 50
Description :For Oppo Series Integrated Reballing Template Live For Mi For Huawei For Vivo New Version Of The Cpu Source, Power Supply, Etc.Features :1. Brand New.2. Wylie Bga Font Power Ic Reballing Template Wl-50 - BLACK Ic Reballing Pins Solder Tin Plant Net,Wylie Square Hole Heating Steel M..
₹350.00
Ex Tax:₹350.00
Brand: WYLIE
Item Code/Product Code: WL 52
Description :For Oppo Series Integrated Reballing Template Live For Mi For Huawei For Vivo New Version Of The Cpu Source, Power Supply, Etc.Features :1. Brand New.2. Wylie Cpu Font Power Ic Reballing Template Wl-52 - Silver Ic Reballing Pins Solder Tin Plant Net,Wylie Square Hole Heating Steel MeshA..
₹250.00
Ex Tax:₹250.00