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STENCILS/BALL PLATE

STENCILS/BALL PLATE

Brand: MIJING Item Code/Product Code: iPH 14
0.12mm Mijing iPH-14 BGA Reballing Stencil Plant Tin Steel Net for iPhone  X / XS / XS Max / 11 / 11 Pro / 11 Pro Max Series IC Repair Tool Features: High-Precision BGA Reballing Stencil: The MijingiPH-14 is specifically designed for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Ma..
₹120.00
Ex Tax:₹120.00
MIJING M22 PRO 4-IN-1 MULTIFUNCTIONAL DOUBLE-SIDED MAGNETIC HEAT-RESISTANT SILICONE PAD MIJING M22 PRO 4-IN-1 MULTIFUNCTIONAL DOUBLE-SIDED MAGNETIC HEAT-RESISTANT SILICONE PAD
-19 %
Brand: MIJING Item Code/Product Code: M22 PRO
Mijing M22 Pro 4-in-1 Multifunctional Double-sided Magnetic Heat-resistant Silicone PadFeatures: Multifunctional magnetic pad, double-sided use, four different depths Silicone material, high-temperature resistance, corrosion-resistant, stand wear and tear Strong magnetic adsorption, avoid shiftin..
₹485.00 ₹600.00
Ex Tax:₹485.00
Brand: MIJING Item Code/Product Code: Z20 Pro
Mijing Z20 Pro Motherboard Middle Layer Planting Tin Platform for iPhone X to 16 Pro Max Features: Mijing Z20 Pro Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/XS/XS Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/..
₹3,650.00
Ex Tax:₹3,650.00
MTK MT-1 SERIES POWER IC BGA REWORK REBALLING STENCILS MTK MT-1 SERIES POWER IC BGA REWORK REBALLING STENCILS
-28 %
Brand: AMAOE Item Code/Product Code: MT-1
AMAOE 19 in 1 MTK MT Series Power IC BGA Reballing Stencil Template, 0.12MM MTK phones power IC Repair BGA Rework Reballing Stencil Template kit, with imported steel material and heat dissipating holes for professional soldering rework repairs. MT6311P MT6339A MT6155A MT66280P power IC BGA Reballing..
₹145.00 ₹200.00
Ex Tax:₹145.00
Brand: NEXST Item Code/Product Code: CHG-1
Nexst CHG1 0.12mm Charging IC Comprehensive BGA Reballing Stencil Package includes: 1 x Stencil..
₹165.00 ₹180.00
Ex Tax:₹165.00
NEXST EMMC-3 (BLACK) BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
-9 % Out Of Stock
Brand: NEXST Item Code/Product Code: EMMC-3
Precision Stencil for EMMC Circuitry Repairs:Features:  Model-Specific Design: Tailored specifically for the EMMC 3 For UFS/NAND series , ensuring a perfect fit for precise repair work. High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding compon..
₹200.00 ₹220.00
Ex Tax:₹200.00
NEXST MQ 6 BLACK QUALCOMM/MTK POWER IC REWORK REBALLING STENCILS - 0.12MM
-9 % Out Of Stock
Brand: NEXST Item Code/Product Code: MQ-6
Nexst Mq 6 Black Qualcomm/Mtk Power Ic Rework Reballing Stencils - 0.12MMFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. ..
₹200.00 ₹220.00
Ex Tax:₹200.00
Brand: NEXST Item Code/Product Code: PM 4450
Precision Stencil for PM4450 Circuitry Repairs:Features:  Model-Specific Design: Tailored specifically for the PM 4450 For PM series , ensuring a perfect fit for precise repair work. High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component..
₹199.00
Ex Tax:₹199.00
NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM
-9 % Out Of Stock
Brand: NEXST Item Code/Product Code: SAM-16
Nexst Sam-16 Black Cpu Bga Rework Reballing Stencil 0.12MMFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. Precise Pins Lo..
₹200.00 ₹220.00
Ex Tax:₹200.00
NEXST U-SMU2 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS - 0.12MM
-28 %
Brand: NEXST Item Code/Product Code: U-SMU2
Nexst U-Smu2 Cpu Bga Reballing Stencil For Samsung ExynosFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. Precise Pins Loc..
₹145.00 ₹200.00
Ex Tax:₹145.00
NEXST UNIVERSAL BLACK STENCIL 0.3/0.35/0.4/0.5 MULTIFUNCTIONAL REBALLING STENCILS - 0.12MM
-20 % Out Of Stock
Brand: NEXST Item Code/Product Code: UNIVERSAL
Description: NEXST Black Steel BGA Reballing Stencil Kit 0.3/0.35/0.4/0.5mm multifunction universal steel mesh for tin planting.   Features: 1. High Quality Stainless Steel Reballing Stencil 2. Colour: Black (Square Hole ). 3. Make your repair work easier. Package contains: 1 x Nexst ..
₹199.00 ₹250.00
Ex Tax:₹199.00
Brand: AMAOE Item Code/Product Code: OV-9
Professional-grade  Amaoe OV-9 reballing stencil for MediaTek and Snapdragon processors in OPPO/VIVO smartphones. High-precision template ensures accurate chip soldering during motherboard repair.Features:Precision-engineered stainless steel construction for durabilityCompatible with multi..
₹145.00
Ex Tax:₹145.00
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