STENCILS/BALL PLATE
-20 %
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: A8 CPU
Manufacturer:QianLiCompatible With:iPhone 6S/6PWhat’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 6S/6P - QS01If you are ever unsure of how to install your part or would like any assistance, please feel free to contact us.Please make sure you have chosen the right pa..
₹199.00 ₹250.00
Ex Tax:₹199.00
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: HW-4
BGA stencils HI6220 / 6250 / MSM8952 CPU (HW:4) 0.12mmPioneering half etching processCooling hole patented designUltra-precise round square hole positioning0.12MM STENCILS PLATES FOR HUAWEI- P8 / P9,HONOR 4X / 4C/ 5A / 5C / HI6220 / MAM8952 CPU (HW-4)..
₹400.00
Ex Tax:₹400.00
Hot
-18 %
Brand: QIANLI/MEGA IDEA
Item Code/Product Code: BZ-26
Qianli 0.12MM Black Stencil Universal 0.3/0.35/0.4/0.5 Multifunctional Reballing Stencils ( BZ 26 )Packing Content*1x Qianli 0.12MM Black Stencil Universal 0.3/0.35/0.4/0.5 Multifunctional Reballing Stencils ( BZ 26 )..
₹230.00 ₹280.00
Ex Tax:₹230.00
New
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 67
The QIANLI QS-67 BGA IC Rework Reballing Stencil is designed for precise reballing of mobile BGA ICs, ensuring accurate soldering and easy repair tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design ..
₹145.00
Ex Tax:₹145.00
New
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 63
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing KitFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repa..
₹145.00
Ex Tax:₹145.00
-18 %
In Stock
Brand: MECHANIC
Item Code/Product Code: VS04
Advantage: 1. Deformation resistant material2. Precise pins location3. Square round hole4. Good materialProduct Specification:Brand Name: WELSOLOModel Number: UNIVERSAL STENCILSMaterial: SteelUsage: ReballingColour: WHITEType: For BGA/CPUOperating Temperature: -50~500CModel : ( VS04 ..
₹99.00 ₹120.00
Ex Tax:₹99.00
Item Code/Product Code: IP 12
WL Gold BGA CPU IC Reballing Stencil Tin Net for iPhone 12 /12 PRO/ 12 PRO MAX
Package includes:
1 x Gold Stencil net..
₹350.00
Ex Tax:₹350.00
Out Of Stock
Brand: WYLIE
Item Code/Product Code: EMMC/EMCP
Description ;WYLIE EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 3D.
3D WYLIE BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.Features :
1. Brand New.
2. BGA stencil for reballing pins for MP..
₹550.00
Ex Tax:₹550.00
Out Of Stock
Brand: WYLIE
Item Code/Product Code: WL 50
Description :For Oppo Series Integrated Reballing Template Live For Mi For Huawei For Vivo New Version Of The Cpu Source, Power Supply, Etc.Features :1. Brand New.2. Wylie Bga Font Power Ic Reballing Template Wl-50 - BLACK Ic Reballing Pins Solder Tin Plant Net,Wylie Square Hole Heating Steel M..
₹350.00
Ex Tax:₹350.00
Out Of Stock
Brand: WYLIE
Item Code/Product Code: WL 52
Description :For Oppo Series Integrated Reballing Template Live For Mi For Huawei For Vivo New Version Of The Cpu Source, Power Supply, Etc.Features :1. Brand New.2. Wylie Cpu Font Power Ic Reballing Template Wl-52 - Silver Ic Reballing Pins Solder Tin Plant Net,Wylie Square Hole Heating Steel MeshA..
₹250.00
Ex Tax:₹250.00