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NASAN NA-PAD8 2 IN 1 TOUCH SEPARATING PAD FOR MOBILE PHONE AND IWATCH NASAN NA-PAD8 2 IN 1 TOUCH SEPARATING PAD FOR MOBILE PHONE AND IWATCH
In Stock
Brand: NASAN Item Code/Product Code: PAD8
DESCRIPTION :NASAN Universal Suction Pad  For All LCD Separator Phone Screen Heating Fixed Inhalation Cleaning Repair Mat.A Universal Suction Pad for smartphones on a glass or torpedo will allow you to comfortably place your mobile phone. The holder Pad hesuits for heating, fixed inhalation, cl..
₹249.00
Ex Tax:₹249.00
NASAN NA-SPA TOUCH SEPARATOR MACHINE NASAN NA-SPA TOUCH SEPARATOR MACHINE
Out Of Stock
Brand: NASAN Item Code/Product Code: NA-SPA
DescriptionFunction1.It is Intelligent Manual LCD Separator. 2.ABS body + tempered glass heating plate;3.Independent operating system,vacumm & heating working separately , one button setting !4.Touch Key;5.Unibody design & colourful boxProduct NameLCD separator machineModelNA-SPATypeBuilt In..
₹1,199.00
Ex Tax:₹1,199.00
NASAN NA-SUPA LITE OCA LAMINATING MACHINE FOR FLAT/CURVED MOBILE LCD REPAIR - 3IN1 SET NASAN NA-SUPA LITE OCA LAMINATING MACHINE FOR FLAT/CURVED MOBILE LCD REPAIR - 3IN1 SET
-14 %
Brand: NASAN Item Code/Product Code: NA-SUPA LITE
Nasan NA-Supa Lite Mini Air Bag Type LCD Laminating Machine for LCD Flat/Curved Screen RepairFeatures: Built-in pump, no need for external The whole machine can be laminated with a frame Adjustable pressure, maximum pressure 9KG No need for mold to press straight and curved screen Water condens..
₹34,500.00 ₹40,000.00
Ex Tax:₹34,500.00
NEXST CHG-1 CHARGING IC REBALLING STENCIL FOR BQ/SM/ET SERIES - 0.12MM
-22 % Out Of Stock
Brand: NEXST Item Code/Product Code: CHG-1
Nexst CHG1 0.12mm Charging IC Comprehensive BGA Reballing Stencil Package includes: 1 x Stencil..
₹140.00 ₹180.00
Ex Tax:₹140.00
NEXST EMMC-3 (BLACK) BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
-36 % Out Of Stock
Brand: NEXST Item Code/Product Code: EMMC-3
Precision Stencil for EMMC Circuitry Repairs:Features:  Model-Specific Design: Tailored specifically for the EMMC 3 For UFS/NAND series , ensuring a perfect fit for precise repair work. High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding compon..
₹140.00 ₹220.00
Ex Tax:₹140.00
NEXST MQ 6 BLACK QUALCOMM/MTK POWER IC REWORK REBALLING STENCILS - 0.12MM
-9 % Out Of Stock
Brand: NEXST Item Code/Product Code: MQ-6
Nexst Mq 6 Black Qualcomm/Mtk Power Ic Rework Reballing Stencils - 0.12MMFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. ..
₹200.00 ₹220.00
Ex Tax:₹200.00
NEXST PM4450 POWER IC REBALLING STENCILS - 0.12MM
Out Of Stock
Brand: NEXST Item Code/Product Code: PM 4450
Precision Stencil for PM4450 Circuitry Repairs:Features:  Model-Specific Design: Tailored specifically for the PM 4450 For PM series , ensuring a perfect fit for precise repair work. High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component..
₹199.00
Ex Tax:₹199.00
NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM
-36 % Out Of Stock
Brand: NEXST Item Code/Product Code: SAM-16
Nexst Sam-16 Black Cpu Bga Rework Reballing Stencil 0.12MMFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. Precise Pins Lo..
₹140.00 ₹220.00
Ex Tax:₹140.00
NEXST U-SMU2 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS - 0.12MM
-28 %
Brand: NEXST Item Code/Product Code: U-SMU2
Nexst U-Smu2 Cpu Bga Reballing Stencil For Samsung ExynosFeatures : 1. Brand New. 2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh Advantage: 1. Deformation Resistant Material 2. Precise Pins Loc..
₹145.00 ₹200.00
Ex Tax:₹145.00
NEXST UNIVERSAL BLACK STENCIL 0.3/0.35/0.4/0.5 MULTIFUNCTIONAL REBALLING STENCILS - 0.12MM
-44 % Out Of Stock
Brand: NEXST Item Code/Product Code: UNIVERSAL
Description: NEXST Black Steel BGA Reballing Stencil Kit 0.3/0.35/0.4/0.5mm multifunction universal steel mesh for tin planting.   Features: 1. High Quality Stainless Steel Reballing Stencil 2. Colour: Black (Square Hole ). 3. Make your repair work easier. Package contains: 1 x Nexst ..
₹140.00 ₹250.00
Ex Tax:₹140.00
NT 150G ROSIN SOLDERING FLUX PASTE/SOLDER WELDING GREASE CREAM FOR PHONE PCB NT 150G ROSIN SOLDERING FLUX PASTE/SOLDER WELDING GREASE CREAM FOR PHONE PCB
Out Of Stock
Item Code/Product Code: ZJ-18
Product details Rosin flux is used to facilitate soldering. It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds. It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process. Perfe..
₹120.00
Ex Tax:₹120.00
NT 50G ROSIN SOLDERING FLUX PASTE/SOLDER WELDING GREASE CREAM FOR PHONE PCB NT 50G ROSIN SOLDERING FLUX PASTE/SOLDER WELDING GREASE CREAM FOR PHONE PCB
-10 % Out Of Stock
Item Code/Product Code: ZJ-18
Product details Rosin flux is used to facilitate soldering. It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds. It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process. Perfe..
₹45.00 ₹50.00
Ex Tax:₹45.00
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