-20 %
NEXST SAM-16 BLACK CPU BGA REWORK REBALLING STENCIL 0.12MM
Product Id: 3556
- Item Code/Product Code: SAM-16
- Weight: 0.01kg
₹199.00
₹250.00
Ex Tax: ₹199.00
Nexst Sam-16 Black Cpu Bga Rework Reballing Stencil 0.12MM
Features :
1. Brand New.
2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh
Advantage:
1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material
Model Numbers Supported ;
- 58083-11
- 77098B
- SPU13P
- SHANNON 5511
- SPU14P
- QFM3576
- SM5714
- SAMSUNG E8825
- BGA 254
- SAMSUNG E8825 -2
- W2205
- S2131Y
- B267-11
- QPA5580
- SAMSUNG A53
- SAMSUNG A536
- EXYNOS 1280
Package Content*
1 X Nexst SAM-16 Stencil.
Tags:
NEXST
, BALL PLATE
, REBALLING STENCILS
, SAMSUNG A53
, SAMSUNG STENCILS
, BLACK STENCILS
, BGA STENCILS
, STENCIL PLATE
,