Id: 2839
- Item Code/Product Code: EMMC-2
- Weight: 0.01kg
The AMAOE BGA Reballing Stencil for EMMC-2 is a professional-grade tool for micro-soldering and chip reballing. Made of durable stainless steel, this stencil ensures precise alignment and solder ball application on EMMC chips, making it essential for advanced PCB and IC repair work. Ideal for technicians working with surface-mount devices and BGA chipsets.
AMAOE BGA REBALLING STENCIL FOR EMMC-2 FEATURE
Features :
1. Brand New.
2. BGA stencil for reballing pins, BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh.
Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material
MODEL NUMBERS SUPPORTED ;
BGA221
BGA153
BGA169
BGA254
BGA162
BGA186
Package Content*
1x AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
