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AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES

AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES
-28 %
AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES

  • Product Id: 3163

  • Item Code/Product Code: MI-11
  • Weight: 0.02kg
AMAOE AMAOE
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₹200.00
Ex Tax: ₹145.00
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Amaoe Mi11 0.12MM BGA Stencil IC Solder Reballing Tin Net for Xiaomi CC9/CC9e/A3/Redmi NOTE8 SM6125/SDM710 CPU


Supported for:

  1. SDR660
  2. PMI632
  3. PM6125
  4. BGA254
  5. PM670
  6. PM670L
  7. WCD9370
  8. MT6360P
  9. SM6125
  10. SDM710
  11. MT6785V
  12. WCN3980
  13. WCN3950
  14. MT6359VKP
  15. MT6186MV
  16. SNAPDRAGON 665
  17. REDMI CC9
  18. REDMI CC9E
  19. REDMI 8SE
  20. REDMI A3
  21. REDMI NOTE 8
  22. REDMI NOTE 8 PRO


Package includes:

  • 1 x Stencil


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Tags: AMAOE , REBALLING STENCILS , STENCILS , BALLPLATE , IC REBALLING STENCILS , REDMI REBALLING STENCILS , REDMI NOTE 8 STENCIL FOR IC REBALLING , AMAOE MI-11 ,

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