AMAOE MU-1 SERIES POWER IC BGA REWORK REBALLING STENCIL

AMAOE MU-1 Power IC Stencil for MTK MT6732 / MT6750 / MT6795W / MT6797W

Repairing complex power ICs on mobile motherboards demands exceptional precision. Errors in reballing these tiny components can lead to unstable device performance or complete failure. A reliable BGA reballing stencil is critical to ensuring accurate solder placement, minimizing rework, and achieving successful power management repairs. The AMAOE MU-1 Series Power IC BGA Rework Reballing Stencils are engineered to provide the accuracy and consistency professional technicians need.

Tips for Optimal Use and Maintenance

Proper handling and maintenance are key to maximizing the lifespan and accuracy of your AMAOE MU-1 Series stencils. Following these best practices will ensure consistent, professional results.

• Clean After Each Use: Always clean the stencil thoroughly with isopropyl alcohol and a soft, lint-free cloth or brush after each reballing session. This prevents solder paste buildup and maintains aperture clarity.
• Accurate Alignment: Before applying solder paste, ensure the stencil is perfectly aligned with the power IC and motherboard pads. Precision alignment is crucial for successful solder ball placement.
• Store Properly: Keep stencils in a flat, dry, and dust-free environment. Using a dedicated storage box helps prevent bending, scratches, or corrosion, preserving their intricate patterns.
• Monitor Heat Application: While heat-resistant, avoid prolonged exposure to excessively high temperatures. Use appropriate preheating techniques to ensure even heat distribution during the reballing process.

Features

• Material: High-hardness Japanese steel sheet
• Sternness: Ultra-hard for prolonged use
• Hole Type: Square design for accurate BGA soldering
• Thickness: 0.12MM for optimal thermal control
• Reusable: Long life, cleanable design
• Precision Fit: Tailored for Power ICs and small-pitch components
• Consistent Flow: Maintains solder volume for reliable joints