AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

Description :

0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.

Features :
1. Brand New.
2. BGA stencil for reballing pins,  BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh.

Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material

MODEL NUMBERS SUPPORTED ;

BGA221

BGA153

BGA169

BGA254

BGA162

BGA186

Package Content*

1x AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM