WL Gold BGA CPU IC Reballing Stencil Tin Net for iPhone 12 /12 PRO/ 12 PRO MAX
WL Gold BGA Reballing Stencil is designed for CPU IC repair on iPhone 12, 12 Pro, and 12 Pro Max. Made from premium gold-coated steel, this durable tin net offers high precision, repeat use, and easy alignment for professional-grade chip reballing.
Features
- Material: Gold-coated high-tensile steel
- Compatibility: iPhone 12 / 12 Pro / 12 Pro Max CPU IC
- Hole Type: Ultra-fine square grid for precise soldering
- Re-usable: Yes, supports multiple reballing cycles
- Thickness: Optimized for heat distribution and durability
- Alignment: Accurate stencil layout for stable chip placement
- Use Case: Ideal for chip reballing and IC repair workflows
Package includes:
