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AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM

AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM
AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM
-28 %
AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM
AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM
AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM

  • Id: 2525

  • Item Code/Product Code: BGA A14
  • Weight: 0.01kg
AMAOE AMAOE
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AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM

The AMAOE IP 12 Series A14 BGA Reballing Stencil is engineered for flawless rework of iPhone 12 A14 BGA IC chips. Made from premium stainless steel, it ensures precise solder ball placement, improving repair accuracy and efficiency. Its durable, reusable design suits professional technicians seeking reliable, high-quality reballing tools. Compatible with various iPhone 12 models, this stencil simplifies IC reballing and helps extend device lifespan.
MODEL NUMBERS SUPPORTED:
IP 12 MINI
IP 12
IP 12 PRO
IP 12 PRO MAX
A14 CPU
Package Content*
1x AMAOE IP 12 SERIES-A14 BGA IC REWORK REBALLING STENCILS 0.12MM

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Tags: AMAOE , STENCIL , A13 , REBALLNG PLATE , IP 12 MINI , AMAOE IP 12

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