New
Amaoe U-Scu2 Stencil for SCU2 Power IC Repair 0.12mm
Id: 4054
- Item Code/Product Code: USCU2
- Weight: 0.05kg
₹145.00
Ex Tax: ₹145.00
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.
Features:
- Made of strong stainless steel
- 0.12mm thickness for accuracy
- Reusable and durable
- Easy to use for mobile repair
- Durable, reusable design for professional rework environments
- Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
- SCU2 Power IC (Qualcomm)
- Compatible with devices using SCU2 PMIC in Snapdragon platforms
