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MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX

MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
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MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
MECHANIC IBGA 12 PRO BGA REBALLING PLATFORM FOR IPHONE X-12 PRO MAX
  • Item Code/Product Code: IBGA 12 PRO
  • Weight: 0.20kg
₹1,650.00
Ex Tax: ₹1,650.00

Description

Mechanic iBGA 12 Pro 10 in 1 motherboard middle rework tin mesh platform for iPhone X-12 Pro Max repair. Mechanic motherboard middle frame positioning tin planting platform for iPhone X-12 Pro Max motherboard middle layer soldering repair.


Features:

1. Mechanic iBGA 12 Pro 10 in 1 set: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini.

2. Strong magnetic automatic positioning: Built-in strong magnetic adsorption, double-sided automatic positioning.

3. High precision and precise alignment: The stencil and pad tightly, make solder paste scraping and tin planting easier.

4. Remove the stencil and plant the tin, the tin ball is full and uniform: Effectively prevent stencil from bulging make the service life longer.


Product Specification:

Item Name: Mid-level Motherboard Positioning Tin Platform

Brand: Mechanic

Model: iBGA 12 Pro

Color: Blue

Product Size: 65*105*11mm

Packing Size: 95*125*20mm

Net Weight: 175g

Gross Weight: 205g

Scope of Application: Perfect iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini motherboard box RF small board positioning, tin-plating repair applications.




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