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MIJING INTERPOSER MIDDLE LAYER BGA REBALLING BOARD MIDDLE FRAME FOR IPHONE X

MIJING INTERPOSER MIDDLE LAYER BGA REBALLING BOARD MIDDLE FRAME FOR IPHONE X
MIJING INTERPOSER MIDDLE LAYER BGA REBALLING BOARD MIDDLE FRAME FOR IPHONE X
MIJING INTERPOSER MIDDLE LAYER BGA REBALLING BOARD MIDDLE FRAME FOR IPHONE X
MIJING INTERPOSER MIDDLE LAYER BGA REBALLING BOARD MIDDLE FRAME FOR IPHONE X
MIJING INTERPOSER MIDDLE LAYER BGA REBALLING BOARD MIDDLE FRAME FOR IPHONE X

  • Product Id: 3058

  • Item Code/Product Code: IP-X
  • Weight: 0.01kg
MIJING MIJING
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₹299.00
Ex Tax: ₹299.00
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Description:

1.Mijing interposer middle plate for iPhone X.

2.iPhone X double-stacked board separation frame.

3.MJ iPhone motherboard middle layer reballing frame for motherboard upper lower layer separating soldering.


Compatible Models: For iPhone X


Package Contains:

1 x Middle Layer Plate





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Tags: MIJING , MIDDLE LAYER IPHONE , MIDDLE PLATE FOR IPHONE X , MIJING INTERPOSER , MIDDLE LAYER

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