Mijing A13 3D BGA Reballing Stencil for Apple iPhone 11 / 11 Pro / 11 Pro Max

Mijing 3D A13 BGA Reballing Stencil Plant Tin Steel Net For iPhone 11 / 11 Pro / 11 Pro Max Series IC Repair Tool

Features:

1. High-temperature resistance can be used 1000 times
2. 3D groove design enables stencil to align with the tinning position of IC rapidly.
3. The square holes design makes it easier to take out the formed solder balls.
4. This 3D stencil is easy to use no matter you are a new or an expert.
5. High success rate of planting tin, the solder balls can be formed once after you are proficient.
6. Square rounded hole design
7. High-temperature resistance up to 700°C

  Package includes:

  1 x 3D Stencil 

Frequently Asked Questions (FAQ)

Q1: Which iPhone chips is this stencil compatible with?

A: It works with iPhone 11 / 11 Pro / 11 Pro Max IC chips.

Q2: What is this stencil used for?

A: It's used for BGA Reballing—placing solder balls on iPhone ICs during motherboard repair.

Q3: Is this a 3D stencil?

A: Yes, it’s a 3D plant tin stencil, offering better precision and solder alignment.