YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair

The YCS Arc Pad BGA Tin Planting Mat is a high-precision magnetic mat designed for professional CPU, IC, and hard disk soldering. Featuring strong magnetic adsorption and durable steel mesh, it ensures stable positioning of components while enhancing reballing efficiency.

Key Features

• Strong Magnetic Base: Ensures firm grip on IC chips and stencils for precise work.
• Arc Shape Pad Design: Ideal for planting tin and aligning BGA chips smoothly.
• Durable Steel Mesh: High-quality magnetic steel mesh with excellent reusability.
• Anti-Slip Surface: Prevents displacement of components during rework.
• Portable & Lightweight: Easy to carry and use in any repair workstation.

Specifications

• Product Name: YCS Arc Pad Tin Planting Mat
• Material: Magnetic Steel + Heat-resistant Pad
• Type: BGA Tin Planting / Soldering Mat
• Compatibility: CPU, IC, NAND, HDD Chips
• Reusability: Yes
• Surface Type: Anti-slip Arc Design
• Usage: Phone PCB Repair, Chip Reballing
• Portability: Compact and lightweight

Best Use For

• Professional mobile repair shops
• IC/BGA reballing stations
• Technicians handling CPU or NAND chips
• Secure tin planting on sensitive chipsets

Package Included: