AMAOE IP 6S/6SP-A9 BGA IC REWORK REBALLING STENCILS 0.12MM

AMAOE IP 6S / 6SP-A9 BGA IC REWORK REBALLING STENCIL

Restore and repair with confidence using the AMAOE IP 6S/6SP-A9 BGA IC Rework Reballing Stencil, engineered for high-precision chip reballing on Apple A9 processors (iPhone 6S/6S Plus). With a 0.12mm ultra-fine thickness, this stencil delivers the accuracy needed for professional micro-soldering, making it ideal for technicians, repair shops, and advanced DIYers.

1. Model-Specific Design: Perfectly aligned for A9 BGA IC chips in iPhone 6S and 6S Plus.
2. 0.12mm Thickness: Offers optimal balance between flexibility and durability for clean solder ball placement.
3. Time-Saving Tool: Speeds up the rework process while improving accuracy and reducing rework failures.

MODEL NUMBERS SUPPORTED;

1. IP 6S
2. IP 6S PLUS
3. A9 CPU

Package Content*

• 1 x AMAOE IP 6S/6SP-A9 BGA IC REWORK REBALLING STENCIL