AMAOE IP 11/11 PRO/11 PRO MAX-A13 BGA IC REWORK REBALLING STENCILS 0.12MM

AMAOE IP 11/11 PRO/11 PRO MAX-A13 BGA IC REWORK REBALLING STENCILS 0.12MM

The AMAOE A13 BGA Reballing Stencil is specifically designed for iPhone 11, 11 Pro, and 11 Pro Max models. Crafted from high-quality Japanese steel with a thickness of 0.12mm, it ensures precise solder application for A13 CPU, RAM, and NAND IC components. This durable and reusable stencil is essential for technicians performing motherboard repairs and IC rework, providing accurate alignment and efficient soldering processes.

MODEL NUMBERS SUPPORTED;

1. IP 11
2. IP 11 PRO
3. IP 11 PRO MAX
4. A13 CPU

Package Content

• 1x AMAOE IP 11/11 PRO/11 PRO MAX-A13 BGA IC REWORK REBALLING STENCILS 0.12MM