AMAOE MI-11 CPU BGA REBALLING STENCIL FOR REDMI SERIES

Amaoe Mi11 0.12MM BGA Stencil IC Solder Reballing Tin Net for Xiaomi CC9/CC9e/A3/Redmi NOTE8 SM6125/SDM710 CPU

Amaoe Mi11 0.12MM BGA stencil for Xiaomi/Redmi: SDR660 stencil, PMI632 stencil, PM6125 stencil, BGA254 stencil, PM670 stencil, PM670L stencil, WCD9370 stencil, MT6360P stencil, SM6125 stencil, SDM710 stencil, MT6785V stencil, WCN3980 stencil, WCN3950 stencil, MT6359VKP stencil, MT6186MV stencil, Snapdragon 665 stencil, Redmi CC9 stencil, CC9e stencil, 8SE stencil, A3 stencil, Note 8 stencil, Note 8 Pro stencil.

Supported for:

1. SDR660
2. PMI632
3. PM6125
4. BGA254
5. PM670
6. PM670L
7. WCD9370
8. MT6360P
9. SM6125
10. SDM710
11. MT6785V
12. WCN3980
13. WCN3950
14. MT6359VKP
15. MT6186MV
16. SNAPDRAGON 665
17. REDMI CC9
18. REDMI CC9E
19. REDMI 8SE
20. REDMI A3
21. REDMI NOTE 8
22. REDMI NOTE 8 PRO

Package includes:

• 1 x Stencil