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KAISI BGA-IC REMOVER LIQUID TOOL (20ML)

KAISI BGA-IC REMOVER LIQUID TOOL (20ML)
Out Of Stock
KAISI BGA-IC REMOVER LIQUID TOOL (20ML)
  • Product Id: 2051

  • Item Code/Product Code: BGA-IC
  • Weight: 0.03kg
₹360.00
Ex Tax: ₹360.00
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Feature:

  • 20ml BGA IC glue epoxy remover.

  • Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.

  • Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

  • It won't do harm to your circuit board and components.

  • Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.

  • Convenient to use

    How to Use:

    • 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.

    • 2. Place a plastic bag or film on the top and cover the PCB board.

    • 3. Wait for about 20 minutes.

    • 4. Redo step 1 to step 3.

    • 5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.

    • 6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.

    • 7. To remove the chip with a tweezers or cutter

    Package included:

    • 1 x BGA Glue

    • 1 x User Manua

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Tags: KAISI , TOOLS