AMAOE U-SMU3 CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS - 0.12MM

Precision Stencil for SAMSUNG EXYNOS Circuitry Repairs:

Features: 

• Model-Specific Design: Tailored specifically for the U-SMU3 For SAMSUNG EXYNOS series , ensuring a perfect fit for precise repair work.
• High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement.
• Ultra-Thin Construction: Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
• Durable Material: Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
• Alignment Markings: Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
• Uniform Hole Distribution: Strategically placed holes to provide even distribution of soldering paste and minimize waste.
• Versatile Application: Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
• Easy to Clean and Maintain: The stencil can be easily cleaned with standard solvent to ensure long-term usability.
• Protective Packaging: Comes with appropriate packaging to protect against bending and damage during storage or transport.

Model supported : 

1. Exynos 2100
2. Exynos 9815
3. Exynos 1080
4. Exynos 900
5. Exynos 9820
6. Exynos 2200
7. Exynos E9925
8. RAM 496
9. RAM 556
10. Exynos 9810

This professional-grade stencil is an essential tool for technicians specializing in mobile phone repairs, offering reliability and precision in one package.

Package Content*

1 x Stencil.