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Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Reballing

Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Reballing
Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Reballing
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Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Reballing
Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Reballing
Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Reballing
  • Id: 4130

  • Item Code/Product Code: MU-3
  • Weight: 0.00kg
  • SKU: 37628
₹100.00
Ex Tax: ₹100.00
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Gizmo MU3 Power Green Oil UV Stencil for Precise BGA IC Repair

The Gizmo MU3 Green Oil UV Stencil is designed for professional chip-level repair. It offers accurate UV oil masking for IC base treatment during reballing or IC removal.

Key Features:

  • High precision IC pad alignment
  • Durable and reusable stainless material
  • Perfect UV oil blocking layout

Model Numbers Supported MediaTek:

  • MT6260DA
  • MT6875
  • MT6873V
  • MT6762V
  • MT6739V
  • MT6785V
  • MT6757V
  • MT6771V
  • MT6763V
How to Use:
  • Start by cleaning the IC area or motherboard section thoroughly, then use a hot air gun to ensure it is completely dry.
  • Apply a thin layer of green curing oil using a precision blade—move parallel to the component edge for smooth control.
  • Spread evenly and thinly across the surface. Avoid bubbles and ensure full coverage—thinner layers cure more efficiently.
  • Align the stencil carefully, placing the printed side face-down so the holes align with the pads on the motherboard or chip.
  • Use a UV light source (purple light) to cure the green oil for about 6 to 15 seconds, depending on the oil thickness.
  • Clean the cured area gently using PCB cleaning solution or isopropyl alcohol. Then re-cure briefly to strengthen adhesion—completing the IC pad insulation or repair.
Package Content:
  • 1 x Gizmo MU 3 Green Oil UV Stencil
Frequently Asked Questions
  • Q: What is the Gizmo MU3 Green Oil UV Stencil used for?
  • A: It helps technicians apply green UV oil precisely to IC bases after chip removal, ensuring clean insulation for safe BGA reballing.
  • Q: Is it reusable and durable?
  • A: Yes, it is crafted from long-lasting stainless steel and can be reused with proper cleaning after each use.
  • Q: What devices is the MU3 stencil suitable for?
  • A: It is designed for use in mobile motherboard repair and supports a range of chip layouts commonly found in Android and other smartphones.

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