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Item Code/Product Code: 77643-21
77643 21 mobile integrated circuit for board level repair workMobile phones often fail due to damaged or faulty ICs on the motherboard, leading to power issues, charging faults, or device instability. Replacing the correct IC is critical to restore proper circuit functionality. The 77643 21 Mobile I..
₹99.00 ₹200.00
Ex Tax:₹99.00
Brand: AMAOE
Item Code/Product Code: U-QSD7
Amaoe U-QSD7 Stencil for Snapdragon 7-SeriesPremium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel constructio..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "YCS Magnetic Pad for IC Reballing & BGA Tin Planting – Anti-Slip Base")
-250x250.jpg "YCS Magnetic Pad for IC Reballing & BGA Tin Planting – Anti-Slip Base")
Out Of Stock
Brand: YCS
Item Code/Product Code: Arc Pad
YCS Arc Pad BGA Tin Planting Mat with Magnetic Steel Mesh for CPU/IC RepairThe YCS Strong Magnetic Pad Chip is engineered to hold small and medium ICs, chips, or CPUs steadily during reballing or soldering. This anti-slip magnetic base ensures precision placement and stability without damaging the c..
₹299.00
Ex Tax:₹299.00
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