QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR

Qianli iAtlas 24k Explosion Proof Gold-plated Foil Gasket for Phone Motherboard Reballing Repair

Features:

• 24K gold plating process / better oxidation resistance / better conductivity / explosion-proof tin is stronger
• New inventions in the industry, improve the success rate of maintenance, and gain one step faster
• Fitted with explosion-proof tin, there is support, no fear of deformation "pressing"
• Gold-plated, easy to tin, strong conductivity, simple and practical
• Breaking through precision maintenance standards, experts improve efficiency, and novices reduce manual dependence
• The "top pillar" of precision electronic hardware. During the maintenance process, take out the required gold-plated gasket and place the gasket on the required support point.
• After the gasket is added, a reasonable gap will be increased, so that there is no overflow between the motherboard and the tin paste
• The motherboard is slightly deformed, and it can be supported by spacers
• The fit is more stable, and there is no fear of micro-deformation of the motherboard
• Convenient and easy to take, easy to use with clip
• Wide range of use, middle frame, chip, BGA, all can be used, general electronic components that need to be attached

QianLi iAtlas Solder Explosion Proof 24K Gold-plated Foil

Solar Explosion When Reballing, Tin Adhesion, Avoid Pressing Due To Crooked Motherboard.

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