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QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR

QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
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QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL GASKET FOR PHONE MOTHERBOARD REBALLING REPAIR
  • Item Code/Product Code: IATLAS
  • Weight: 0.02kg
₹2,499.00
Ex Tax: ₹2,499.00

Qianli iAtlas 24k Explosion Proof Gold-plated Foil Gasket for Phone Motherboard Reballing Repair


Features:

  • 24K gold plating process / better oxidation resistance / better conductivity / explosion-proof tin is stronger
  • New inventions in the industry, improve the success rate of maintenance, and gain one step faster
  • Fitted with explosion-proof tin, there is support, no fear of deformation "pressing"
  • Gold-plated, easy to tin, strong conductivity, simple and practical
  • Breaking through precision maintenance standards, experts improve efficiency, and novices reduce manual dependence
  • The "top pillar" of precision electronic hardware. During the maintenance process, take out the required gold-plated gasket and place the gasket on the required support point.
  • After the gasket is added, a reasonable gap will be increased, so that there is no overflow between the motherboard and the tin paste
  • The motherboard is slightly deformed, and it can be supported by spacers
  • The fit is more stable, and there is no fear of micro-deformation of the motherboard
  • Convenient and easy to take, easy to use with clip
  • Wide range of use, middle frame, chip, BGA, all can be used, general electronic components that need to be attached


QianLi iAtlas Solder Explosion Proof 24K Gold-plated Foil


Solar Explosion When Reballing, Tin Adhesion, Avoid Pressing Due To Crooked Motherboard.


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