Product Id: 3284
- Item Code/Product Code: BH-11
- Weight: 0.30kg
2UUL Universal Phone Board Mid Frame Reballing Magnetic Platform For Iphone Cpu Ic Chip Tin Planting Template Fixture
2UUL Universal Silicone Phone Board Mid Frame Reballing Magnetic Platform,Special Design For Phone Board Mid Frame Reballing, 2UUL Universal Silicone Magnetic Platform Motherboard Middle Frame Positioning Tin Planting Platform For Phone Motherboard Middle Layer Soldering Repair.
Features:
1. 2UUL Universal Phone Board Mid Frame Reballing Magnetic Platform.
2. Strong Magnetic Automatic Positioning: Built-In Strong Magnetic Adsorption.
3. High Precision And Precise Alignment: The Stencil And Pad Tightly, Make Solder Paste Scraping And Tin Planting Easier.
4. Remove The Stencil And Plant The Tin, The Tin Ball Is Full And Uniform: Effectively Prevent Stencil From Bulging Make The Service Life Longer.
The tin planting steel mesh and solder paste in the picture are for reference only, and the actual package does not contain any steel mesh and solder paste!!!
Package Includes:
- 1 x Magnetic Platform
- 2 x Blade
