Relife RL-093A Ultra-Thin 0.1MM Copper Chip Heat Sink for BGA IC Cooling

Relife RL-093A Ultra-Thin 0.1MM Copper Chip Heat Sink

Relife RL‑093A is a premium 0.1 mm ultra-thin copper heat sink sheet designed for BGA, IC, and CPU cooling during soldering and rework. It combines exceptional thermal conductivity, corrosion resistance, and smooth, burr-free edges—making it perfect for precision mobile and electronics repairs.

Key Features

• High Thermal Conductivity: Pure copper composition ensures rapid and efficient heat dissipation for sensitive IC and CPU components.
• Ultra-Thin 0.1MM Design: Allows snug fit on uneven chip surfaces without adding height or affecting thermal contact.
• Protects from Overheating: Prevents chip damage during rework or soldering by stabilizing temperature levels. 
• Flexible & Cuttable Material: Can be trimmed to custom sizes for specific chip profiles and repair scenarios.
• Multi-Piece Pack for Efficiency: Comes in a 10-piece pack, ideal for technicians performing frequent repairs.

User Guide

• Clean the component surface – Ensure the chip or PCB area is free from residue, dust, or flux.
• Cut to size – Trim the copper sheet to cover the heat-generating component fully.
• Peel backing – Remove protective liner before application.
• Apply carefully – Place the heat sink on chip or board, flat and secure.
• Clamp or mesh – Use thermal-alloy mesh or clamp to maintain contact during heating.
• Heat/process – Perform rework or reballing procedure as usual.
• Remove after cooling – Once board temperature drops, gently remove the copper sheet.
• Clean residue – Remove any flux and store the copper sheet flat for reuse.

Package Includes

• 1 x Relife RL-093A Copper Heat Sink Sheets Box (0.1MM thickness)