RELIFE RL-407 Thermal Silicone Paste For Mobile Phone CPU GPU Chipset Laptop Fast Cooling

RELIFE RL-407 Thermal Silicone Paste For Mobile Phone CPU GPU Chipset Laptop Fast Cooling

• Applicable to IP/Android mobile phones, laptops, desktop computers, graphics card processors, and various modules with high thermal conductivity requirements.
• Thermal conductivity of 6.0 W/MK, resilience to heat and humidity, and resistance to environmental aging. Allowing electronics to easily handle the heat produced by powerful CPUs and GPUs.
• Possesses good insulation, is non-conductive, and prevents corrosion of different heat dissipation parts.
• Limited fluidity, good plasticity, compressible voids, and limited deformability.
• Clear the CPU's surface of any debris, etc. Then apply the proper amount of thermal grease on the CPU by squeezing it out into an even layer.

Packing Details:

1 x Thermal Paste (Black)