AMAOE MQ 1 Power IC Rework Reballing Stencil

Amaoe MQ 1 Qualcomm/MTK Power IC Rework Reballing Stencil

The AMAOE MQ 1 Power IC Rework Reballing Stencil is engineered for technicians who need high precision during power IC reballing and replacement. This stainless-steel stencil ensures accurate solder paste deposition for chips like PM8150, PM8350, and other Qualcomm power ICs. With its stable thickness and durable build, it’s a trusted tool for BGA rework on modern mobile logic boards.

User Guide

Apply solder paste or balls over the stencil aligned with the chip. Use preheating equipment to ensure even heat distribution. For best results, follow with reflow station or BGA rework tool. Clean after each use to maintain precision.

Features

• Model: MQ 1
• High precision BGA stencil for rework & reballing
• Ideal for power ICs on mobile logic boards
• Stainless steel construction for durability
• Standard thickness: 0.12mm for accurate reballing
• Reusable & compatible with hot air and rework stations
• Laser-cut openings for solder accuracy

Model Numbers Supported

Package Includes

• 1 × AMAOE MQ 1 Power IC Rework Reballing Stencil