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2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR

2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
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2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
2UUL THE MICRO JIG IC FIXTURE WITH TEMPERED INSULATED GLASS FOR MOBILE PHONE MOTHERBOARD REPAIR
  • Product Id: 3431

  • Item Code/Product Code: MICRO JIG
  • Weight: 0.10kg
₹1,099.00
₹1,550.00
Ex Tax: ₹1,099.00
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2uul MICRO JIG IC Mini Tempered Insulated Glass Fixture for Mobile Phone Motherboard Repair.


Features:

1. General mobile phone maintenance fixture, rotary fixed design, no rebound, fixed firmly

2. Prevent clamps from moving during use, special anti-skid pad

3. Let the hot air can be discharged more efficiently, add heat sink to the bottom of the clamp

4. Rotary shaft locks the motherboard or IC more efficiently, fixed well without a rebound

5. Fixtures also support IC type fixtures fixed for the removal of back glue, the clamp is designed to bear the force of the IC beam, which can hold up the empty parts of the IC well and avoid the IC breaking when removing black glue

6. Suitable for mobile phone motherboards of various sizes and shapes

7. Suitable for fixing when cleaning large chips such as CPU and NAND


Package includes:

  • 1 x Fixture

Notes: The electronic parts in the pictures are for reference only, the actual package does not contain any electronic parts.



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